Using various thermal analysis methods, it is possible to investigate and kinetically analyze polymers and additives as well as the curing behavior of reactive adhesives.
Thermal analysis methods can be used for incoming goods inspection, following each process step and in the final inspection. The bond itself can be checked under real-world conditions.
The melting and crystallization behavior of synthetic or natural raw materials, along with a great variety of additives, can be investigated with Differential Scanning Calorimetry (DSC) For sealing materials, the glass transition temperature is analyzed in the low temperature range, since it describes the cold flexibility.
Material composition can be quantified by Thermogravimetric Analysis (TGA). The coupling of a thermo-microbalance to an infrared spectrometer (FTIR) or a Mass Spectrometer (MS) allows for the analysis of gases released and thus for the identification of the adhesive and sealing system.
Increasingly, LFA (Laser Flash Analysis) is being used for the determination of thermal diffusivity and conductivity on thin adhesive layers, since it is a quick, non-contact measuring method. With Thermomechanical Analysis (TMA) or Dynamic-Mechanical Analysis (DMA) the bond can be checked under conditions relevant in practice (as a function of the force, deformation path and frequency).
Both the thermal and the UV-curing of 1K or 2K adhesives can be characterized reliably with DSC and Dielectric Analysis (DEA). Kinetic analysis of the measurement data allows the activation energy for the curing reaction to be determined. In addition, computer simulations can help generate a suitable reaction model for your optimum process conditions and determine the optimum degree of curing.